19^th INTERNATIONAL CONFERENCE ON RELIABILITY AND STRESS-RELATED
PHENOMENA IN NANOELECTRONICS ("STRESS WORKSHOP")

TOPICAL ASPECTS:

AREAS:

Reliability in micro- and nanoelectronics

Logic, FETs

Impact of stress on device properties

Memory devices, neuromorphic/ in-memory computing

Degradation mechanism of materials

Quantum devices

Characterisation and failure analysis

Nanointerconnects and TSVs

Micro and nano-mechanics

3D integration, heterogeneous integration

Thermal management

Flexible electronics

Interfaces

Integrated energy devices

Modelling

Advanced packaging, chiplets, hybrid bonding

3D printing